Features :
Running tin is fast and has less smoke.
No-clean, easy to tin, no residue.
Applicable to mobile phone PCB, BGA and PGA repair.lead-free solder paste maintenance soldering tin for iPhone slurry 138 183 260 degrees environmental protection tin mud CPU tinSpecific..
Features:High bond strength, PH value neutral, insulation is strong, welding surface smooth.IC and PCB for no corrosive.Its boiling point only slightly higher than the melting point of the solder.For mobile phones, PC cards and other sophisticated electronic chip-level help welding.
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Features:Good moisture retention.High purity.Bright color.The tin point is rounded.
Type: A: Medium Temperature B: Low Temperature
Package Included:1 x Medium Low Temperature Tin PasteDetail Pictures:..
Features:
1. It is specifically tailored for high-end smart phones in the communications industry. This is especially for iPhone X series of layered motherboards with a better performance.2. No false soldering, moderate viscosity, not easy to migration, bright and full spot, no residue, good ..
Features :-Pure color, no impurities.-Good activity, strong viscosity and good fluidity.-High insulation resistance, suitable for precision electronic maintenance such as mobile phone motherboards, cpu repair.Specification:Type: Flux PasteDIY Supplies: ElectricalMod..
Features:1. This UV Solder Resist is used to protect PCB traces from corrosion2. Application: Mobiles phone chips repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etcSpecification:Viscosity: 2(Pa·S)Graininess: 2(um) weight: 0.1gPack..
Features :
100% brand new and high quality.
Unique recipes, perfect performance, easy to weld, solder bright and full, no weld, false welding and so on.
Good soldering and welding tool.Specification :
Material: Plastic+solder paste
Color: As picture shown
Size: ..